APA (7th ed.) Citation

Knight, R., & Cheng, E. (2014). Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches. Army Research Laboratory.

Chicago Style (17th ed.) Citation

Knight, Ryan, and Evan Cheng. Non-destructive Damping Measurement for Wafer-level Packaged Microelectromechanical System (MEMS) Acceleration Switches. Adelphi, MD: Army Research Laboratory, 2014.

MLA (9th ed.) Citation

Knight, Ryan, and Evan Cheng. Non-destructive Damping Measurement for Wafer-level Packaged Microelectromechanical System (MEMS) Acceleration Switches. Army Research Laboratory, 2014.