Chemical-Mechanical Planarization of Semiconductor Materials /

This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and the...

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Bibliographic Details
Main Author:	Oliver, Michael R.
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	Berlin, Heidelberg : Springer Berlin Heidelberg, 2004.
Series:	Springer series in materials science ; 69.
Subjects:	Physical organic chemistry. Structural control (Engineering) Electronics. Optical materials. Surfaces (Physics) Electronic books.
Online Access:	Connect to the full text of this electronic book

Table of Contents:

Introduction
CMP Technology
Metal Polishing Processes
Metal CMP Science
Equipment Used in CMP Processes
CMP Polishing Pads
Fundamentals of CMP Slurry
CMP Cleaning
Patterned Wafer Effects
Integration Issues of CMP
Appendix: Pourbaix Diagrams.