Chemical-Mechanical Planarization of Semiconductor Materials /

This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and the...

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Bibliographic Details

Main Author:	Oliver, Michael R.
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	Berlin, Heidelberg : Springer Berlin Heidelberg, 2004.
Series:	Springer series in materials science ; 69.
Subjects:	Physical organic chemistry. Structural control (Engineering) Electronics. Optical materials. Surfaces (Physics) Electronic books.
Online Access:	Connect to the full text of this electronic book