Chemical-Mechanical Planarization of Semiconductor Materials /
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and the...
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| Format: | eBook |
| Language: | English |
| Published: |
Berlin, Heidelberg :
Springer Berlin Heidelberg,
2004.
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| Series: | Springer series in materials science ;
69. |
| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
| Summary: | This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed. |
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| Item Description: | Electronic resource. |
| Physical Description: | 1 online resource (xi, 428 pages) |
| ISBN: | 9783662062340 (electronic bk.) 3662062348 (electronic bk.) |
| ISSN: | 0933-033X ; |