Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® /
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages...
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| Other Authors: | , |
| Format: | eBook |
| Language: | English |
| Published: |
Boston, MA :
Springer US,
2003.
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| Series: | International series in engineering and computer science ;
719. |
| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
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