Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® /

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages...

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Bibliographic Details

Main Author:	Madenci, Erdogan
Corporate Author:	SpringerLink (Online service)
Other Authors:	Guven, Ibrahim, Kilic, Bahattin
Format:	eBook
Language:	English
Published:	Boston, MA : Springer US, 2003.
Series:	International series in engineering and computer science ; 719.
Subjects:	Engineering. Machinery. Computer engineering. Optical materials. Electronic books.
Online Access:	Connect to the full text of this electronic book