Low Dielectric Constant Materials for IC Applications /

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applicat...

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Bibliographic Details
Main Author: Ho, P. S.
Corporate Author: SpringerLink (Online service)
Other Authors: Leu, Jihperng Jim, Lee, Wei William
Format: eBook
Language:English
Published: Berlin, Heidelberg : Springer Berlin Heidelberg, 2003.
Series:Springer series in advanced microelectronics ; 9.
Subjects:
Online Access:Connect to the full text of this electronic book
Description
Summary:Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for <0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
Item Description:Electronic resource.
Physical Description:1 online resource (xix, 310 pages)
ISBN:9783642559082 (electronic bk.)
3642559085 (electronic bk.)
ISSN:1437-0387 ;