Wafer Bonding : Applications and Technology /

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication method...

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Bibliographic Details

Main Author:	Alexe, M. (Marin)
Corporate Author:	SpringerLink (Online service)
Other Authors:	Gösele, U.
Format:	eBook
Language:	English
Published:	Berlin, Heidelberg : Springer Berlin Heidelberg, 2004.
Series:	Springer series in materials science ; 75.
Subjects:	Physics. Computer engineering. Optical materials. Surfaces (Physics) Electronic books.
Online Access:	Connect to the full text of this electronic book