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Failure Modes and Mechanisms in Electronic Packages /

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With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component...

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Bibliographic Details
Main Author: Viswanadham, Puligandla
Corporate Author: SpringerLink (Online service)
Other Authors: Singh, Pratap
Format: eBook
Language:English
Published: Boston, MA : Springer US, 1998.
Subjects:
Engineering.
Microprogramming.
Machinery.
Computer engineering.
Systems engineering.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Summary:With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.
Item Description:Electronic resource.
Physical Description:1 online resource (xxi, 370 pages)
ISBN:9781461560296 (electronic bk.)
1461560292 (electronic bk.)