Failure Modes and Mechanisms in Electronic Packages /

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component...

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Bibliographic Details

Main Author:	Viswanadham, Puligandla
Corporate Author:	SpringerLink (Online service)
Other Authors:	Singh, Pratap
Format:	eBook
Language:	English
Published:	Boston, MA : Springer US, 1998.
Subjects:	Engineering. Microprogramming. Machinery. Computer engineering. Systems engineering. Electronic books.
Online Access:	Connect to the full text of this electronic book