APA (7th ed.) Citation

Kelly, G. (1999). The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages. Springer US.

Chicago Style (17th ed.) Citation

Kelly, Gerard. The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages. Boston, MA: Springer US, 1999.

MLA (9th ed.) Citation

Kelly, Gerard. The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages. Springer US, 1999.

Warning: These citations may not always be 100% accurate.