The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages /

This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. Failures like delaminations, package cracking, and metal shift occur due to the build-up of residu...

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Bibliographic Details

Main Author:	Kelly, Gerard
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	Boston, MA : Springer US, 1999.
Subjects:	Engineering. Mechanics. Machinery. Computer engineering. Systems engineering. Surfaces (Physics) Electronic books.
Online Access:	Connect to the full text of this electronic book