Microscale Heat Conduction in Integrated Circuits and Their Constituent Films /

The study of thermal phenomena in microdevices has attracted significant attention recently. The interdisciplinary nature of this topic, however, makes it very difficult for researchers to fully understand details of research results presented in journal articles. For many researchers intending to b...

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Bibliographic Details

Main Author:	Ju, Y. Sungtaek
Corporate Author:	SpringerLink (Online service)
Other Authors:	Goodson, Kenneth E.
Format:	eBook
Language:	English
Published:	Boston, MA : Springer US, 1999.
Series:	Microsystems ; 6.
Subjects:	Engineering. Mechanics. Computer engineering. Optical materials. Electronic books.
Online Access:	Connect to the full text of this electronic book