Tummala, R. R., Rymaszewski, E. J., & Klopfenstein, A. G. (1997). Microelectronics Packaging Handbook: Technology Drivers Part I (Second edition.). Springer US.
Chicago Style (17th ed.) CitationTummala, Rao R., Eugene J. Rymaszewski, and Alan G. Klopfenstein. Microelectronics Packaging Handbook: Technology Drivers Part I. Second edition. Boston, MA: Springer US, 1997.
MLA (9th ed.) CitationTummala, Rao R., et al. Microelectronics Packaging Handbook: Technology Drivers Part I. Second edition. Springer US, 1997.
Warning: These citations may not always be 100% accurate.