Microelectronics Packaging Handbook : Technology Drivers Part I /

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelec...

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Bibliographic Details

Main Author:	Tummala, Rao R.
Corporate Author:	SpringerLink (Online service)
Other Authors:	Rymaszewski, Eugene J., Klopfenstein, Alan G.
Format:	eBook
Language:	English
Published:	Boston, MA : Springer US, 1997.
Edition:	Second edition.
Subjects:	Engineering. Microprogramming. Machinery. Computer engineering. Systems engineering. Electronic books.
Online Access:	Connect to the full text of this electronic book