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131029s1991 nyua ob 001 0 eng d |
| 005 |
20260422210558.3 |
| 020 |
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|a 9781489925664 (electronic bk.)
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| 020 |
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|a 148992566X (electronic bk.)
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| 020 |
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|z 0306438356
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| 020 |
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|z 9780306438356
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| 024 |
7 |
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|a 10.1007/978-1-4899-2566-4
|2 doi
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| 035 |
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|a (OCoLC)861705495
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| 040 |
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|a GW5XE
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|a TXAM
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| 050 |
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4 |
|a TK7871.85
|b .R58 1991eb
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| 082 |
0 |
4 |
|a 621.381/52
|2 22
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| 084 |
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|a ZM 7660
|2 rvk
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| 084 |
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|a ZN 4950
|2 rvk
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| 100 |
1 |
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|a Roosmalen, A. J. van.
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| 245 |
1 |
0 |
|a Dry etching for VLSI /
|c A.J. van Roosmalen, J.A.G. Baggerman, S.J.H. Brader.
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| 264 |
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1 |
|a New York :
|b Plenum Press,
|c [1991]
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| 264 |
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4 |
|c ©1991
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| 300 |
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|a 1 online resource (xvii, 237 pages) :
|b illustrations.
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| 336 |
|
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|a text
|b txt
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 490 |
1 |
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|a Updates in applied physics and electrical technology
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| 504 |
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|a Includes bibliographical references (pages 157-175) and index.
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| 588 |
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|a Description based on print version record.
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| 650 |
|
0 |
|a Semiconductors
|x Etching.
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| 650 |
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0 |
|a Integrated circuits
|x Very large scale integration
|x Design and construction.
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| 650 |
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0 |
|a Plasma etching.
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| 650 |
0 |
7 |
|a Trockenätzen.
|2 swd
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| 650 |
0 |
7 |
|a VLSI.
|2 swd
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| 650 |
|
7 |
|a Integrated circuits
|x Very large scale integration
|x Design and construction.
|2 fast
|0 (OCoLC)fst00975610
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| 650 |
|
7 |
|a Plasma etching.
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|0 (OCoLC)fst01066327
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| 650 |
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|a Semiconductors
|x Etching.
|2 fast
|0 (OCoLC)fst01112219
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| 655 |
|
7 |
|a Electronic books.
|2 local
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| 700 |
1 |
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|a Baggerman, J. A. G.
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| 700 |
1 |
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|a Brader, S. J. H.
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| 710 |
2 |
|
|a SpringerLink (Online service)
|
| 776 |
1 |
8 |
|i Print version:
|a Roosmalen, A.J. van.
|t Dry etching for VLSI
|z 0306438356
|w (DLC) 91007385
|w (OCoLC)23142645
|
| 830 |
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0 |
|a Updates in applied physics and electrical technology.
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| 856 |
4 |
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f |
|a Texas A&M University
|b College Station
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|e TK7871.85 .R58 1991eb
|h Library of Congress classification
|
| 998 |
f |
f |
|a TK7871.85 .R58 1991eb
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