Manufacturing Challenges in Electronic Packaging /

This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will beco...

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Bibliographic Details
Main Author: Lee, Y. C.
Corporate Author: SpringerLink (Online service)
Other Authors: Chen, W. T.
Format: eBook
Language:English
Published: Boston, MA : Springer US, 1998.
Subjects:
Online Access:Connect to the full text of this electronic book
Description
Summary:This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
Item Description:Electronic resource.
Physical Description:1 online resource (xi, 261 pages)
ISBN:9781461558033 (electronic bk.)
1461558034 (electronic bk.)