Manufacturing Challenges in Electronic Packaging /

This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will beco...

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Bibliographic Details

Main Author:	Lee, Y. C.
Corporate Author:	SpringerLink (Online service)
Other Authors:	Chen, W. T.
Format:	eBook
Language:	English
Published:	Boston, MA : Springer US, 1998.
Subjects:	Engineering. Machinery. Electronic books.
Online Access:	Connect to the full text of this electronic book