Lee, Y. C., & Chen, W. T. (1998). Manufacturing Challenges in Electronic Packaging. Springer US.
Chicago Style (17th ed.) CitationLee, Y. C., and W. T. Chen. Manufacturing Challenges in Electronic Packaging. Boston, MA: Springer US, 1998.
MLA (9th ed.) CitationLee, Y. C., and W. T. Chen. Manufacturing Challenges in Electronic Packaging. Springer US, 1998.
Warning: These citations may not always be 100% accurate.