Physical Design for Multichip Modules /

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of M...

Full description

Bibliographic Details

Main Author:	Sriram, M.
Corporate Author:	SpringerLink (Online service)
Other Authors:	Kang, S. M.
Format:	eBook
Language:	English
Published:	Boston, MA : Springer US, 1994.
Series:	International series in engineering and computer science ; 267.
Subjects:	Engineering. Computer-aided design. Computer engineering. Systems engineering. Electronic books.
Online Access:	Connect to the full text of this electronic book