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Pulsed and pulsed bias sputtering : principles and applications /

This book provides basic knowledge on the design of the instrumentation for pulsed and pulsed bias sputtering techniques as well as the knowledge for the control of thin film properties using the deposition parameters such as pulsing cycle and duty. The book focuses on the basic principles and exper...

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Bibliographic Details
Main Author: Barnat, Edward V.
Corporate Author: SpringerLink (Online service)
Other Authors: Lu, T.-M. (Toh-Ming), 1943-
Format: eBook
Language:English
Published: Boston : Kluwer Academic, [2003]
Subjects:
Cathode sputtering (Plating process)
Thin films.
Pulvérisation cathodique > Applications industrielles.
Couches minces.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Ch. 1. Introduction
  • Ch. 2. Basic Plasma Phenomenon
  • Ch. 3. Plasma Sources Used for Sputter Deposition
  • Ch. 4. Response of a Plasma to an Applied Bias
  • Ch. 5. Sinusoidal, Waveform
  • Ch. 6. Pulsed Waveform
  • Ch. 7. Application of a Pulsed Waveform to a Target: Pulsed Reactive Sputtering
  • Ch. 8. Application of a Pulsed Waveform to a Substrate: Pulsed Bias Sputtering
  • Ch. 9. Conclusions and Future Directions.