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Multichip module technologies and alternatives : the basics /

The first book to provide a framework for understanding the multichip module (MCM) technologies available for package selection. This volume will be relied on by engineers concerned with the design and systems integration of new products and technical managers who decide how to apply to new technolo...

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Bibliographic Details
Corporate Author: SpringerLink (Online service)
Other Authors: Doane, Daryl Ann, Franzon, Paul D.
Format: eBook
Language:English
Published: New York : Van Nostrand Reinhold, [1993]
Subjects:
Microelectronic packaging.
Integrated circuits > Very large scale integration > Design and construction.
Circuitos integrados.
Electronic books.
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Call Number: TK7874 .M864 1993eb
 
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TK7874 .M864 1993eb Available