High-frequency characterization of electronic packaging /
This book gives the reader insight in how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled especially in performing accurate measurements on modern IC-packages and in determination of circuit models. As a comprehensive guide fo...
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| Format: | eBook |
| Language: | English |
| Published: |
Boston :
Kluwer Academic Publishers,
1998.
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| Series: | Electronic packaging and interconnects series.
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| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
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