High-frequency characterization of electronic packaging /

This book gives the reader insight in how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled especially in performing accurate measurements on modern IC-packages and in determination of circuit models. As a comprehensive guide fo...

Full description

Bibliographic Details

Main Author:	Martens, Luc, 1963-
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	Boston : Kluwer Academic Publishers, 1998.
Series:	Electronic packaging and interconnects series.
Subjects:	Electronic packaging. System analysis. Electronic books.
Online Access:	Connect to the full text of this electronic book