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High-frequency characterization of electronic packaging /

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This book gives the reader insight in how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled especially in performing accurate measurements on modern IC-packages and in determination of circuit models. As a comprehensive guide fo...

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Bibliographic Details
Main Author: Martens, Luc, 1963-
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: Boston : Kluwer Academic Publishers, 1998.
Series:Electronic packaging and interconnects series.
Subjects:
Electronic packaging.
System analysis.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • Ch. 1. Electronic packaging and high frequencies
  • Ch. 2. Electrical description of electronic packaging
  • Ch. 3. High-frequency measurement techniques
  • Ch. 4. High-frequency measurement techniques for electronic packaging
  • Ch. 5. Measurement-based modeling algorithms.