Ion implantation : basics to device fabrication /
Ion Implantation: Basics to Device Fabrication is a collection of research dealing with several aspects of ion implantation, including basic information on the physics of devices, ion implanters, channeling implants, yield, damage and its annealing, in addition to a host of other topics. Particular...
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| Format: | eBook |
| Language: | English |
| Published: |
Boston :
Kluwer Academic Publishers,
[1995]
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| Series: | Kluwer international series in engineering and computer science ;
SECS 293. Kluwer international series in engineering and computer science. Electronic materials, science and technology. |
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| Online Access: | Connect to the full text of this electronic book |
Table of Contents:
- 1 Semiconductor Devices
- 1.1 Introduction
- 1.2 Semiconductor Physics
- 1.3 p-n Junction and Diode
- 1.4 Unipolar and Bipolar Transistors
- 1.5 Ion Implantation and Semiconductor Devices
- 1.6 Damage and Yield
- 1.7 Future Trend
- 2 Ion Implanters
- 2.1 Introduction
- 2.2 Ion Sources
- 2.3 High Energy Implanters
- 2.4 Magnetic Analyzer and Beam Transport
- 2.5 Energy Contamination
- 2.6 Scan System and Current Measurement
- 2.7 Wafer Cooling
- 2.8 Wafer Charging
- 2.9 Uniformity Control and Mapping
- 2.10 Contaminants and Yield
- 2.11 Plasma Immersion Ion Implantation
- 3 Range Distribution
- 3.1 Introduction
- 3.2 Elastic Stopping Power
- 3.3 Electronic Energy Loss
- 3.4 Depth Profile of Implanted Ions
- 3.5 Penetration Anomalies
- 3.6 Channeling Implants
- 3.7 Lateral Spreading
- 3.8 Simulation of Range Distribution
- 4 Radiation Damage
- 4.1 Introduction
- 4.2 Collision Cascade
- 4.3 Damage Distribution
- 4.4 Crystalline Defects
- 4.5 Primary Defects
- 4.6 Hot Implants
- 4.7 Ion Beam Induced Enhanced Crystallization
- 4.8 Ion Implantation into Localized Si Areas
- 5 Annealing and Secondary Defects
- 5.1 Introduction
- 5.2 Solid Phase Epitaxial Growth of Amorphous Silicon
- 5.3 Annealing of Low-Dose Heavy - Ion Implant
- 5.4 Regrowth of Amorphous Layer Under a Mask
- 5.5 Annealing of Heavily Disordered Regions
- 5.6 Rapid Thermal Processing
- 5.7 Impurity Diffusion During Annealing
- 5.8 Interaction of Impurities with Ion Implanted Defects
- 5.9 Defect Engineering
- 6 Analytical Techniques
- 6.1 Introduction
- 6.2 Secondary Ion Mass Spectrometry
- 6.3 Spreading Resistance Profilometry: One and Two Dimensional Analyses
- 6.4 Carrier and Mobility Profiles
- 6.5 Rutherford Backscattering and Channeling Effect
- 6.6 Transmission Electron Microscopy
- 7 Silicon Based Devices
- 7.1 Introduction
- 7.2 Threshold Voltage Control in MOSFET
- 7.3 Short Channel Effects
- 7.4 Shallow Junctions
- 7.5 Complementary MOS Devices and Technology
- 7.6 Lifetime Engineering in Power Devices
- 7.7 High Energy Implant Applications
- 7.8 High-Speed Bipolar Transistors
- 8 Ion Implantation in Compound Semi-Conductor and Buried Layer Synthesis
- 8.1 Introduction
- 8.2 Ion Implantation in GaAs
- 8.3 Ion Implantation in InP
- 8.4 Isolation of III-V Semiconductors
- 8.5 Isolation of Superlattice and Quantum Well Structures
- 8.6 Synthesis of Buried Dielectric
- 8.7 Devices in SOI Substrates
- 8.8 Buried Metal Layer Formation
- 8.9 Compound Semiconductor Based Devices
- Selected References
- References.