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Reliability, yield, and stress burn-in : a unified approach for microelectronics systems manufacturing & software development /

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Reliability, Yield, and Stress Burn-In explains reliability issues in Microelectronics Systems Manufacturing and Software Development with an emphasis on evolving manufacturing technology for the semiconductor industry. Since most microelectronics components have their infant mortality period for ab...

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Bibliographic Details
Main Author: Kuo, Way, 1951-
Corporate Author: SpringerLink (Online service)
Other Authors: Chien, Wei-Ting Kary, 1965-, Kim, Taeho, 1960-
Format: eBook
Language:English
Published: Boston, Mass : Kluwer Academic Publishers, [1998]
Subjects:
Integrated circuits > Design and construction > Reliability.
Microelectronics > Reliability.
Computer software > Development > Reliability.
Semiconductors > Computer programs > Reliability.
Semiconducteurs > Logiciels > Fiabilité.
Circuits intégrés > Développement > Fiabilité.
Microélectronique > Fiabilité.
Logiciels > Développement > Fiabilité.
Elektronisches Bauelement.
Zuverlässigkeit.
Electronic books.
Online Access:Connect to the full text of this electronic book
Table of Contents:
  • 1. Overview of Design, Manufacture, and Reliability
  • 2. Integrating Reliability into Microelectronics Manufacturing
  • 3. Basic Reliability Concept
  • 4. Yield and Modeling Yield
  • 5. Reliability Stress Tests
  • 6. Burn-in Performance, Cost, and Statistical Analysis
  • 7. Nonparametric Reliability Analysis
  • 8. Parametric Approaches To Decide Optimal System Burn-in Time
  • 9. Nonparametric Approach and Its Applications to Burn-in
  • 10. Nonparametric Bayesian Approach for Optimal Burn-in
  • 11. The Dirichlet Process for Reliability Analysis
  • 12. Software Reliability and Infant Mortality Period of the Bath-tub Curve
  • Epilogue: Cost-effective Design for Stress Burn-in
  • App. A. Notation and Nomenclature