Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly /
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| Format: | eBook |
| Language: | English |
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New York :
Springer Science+Business Media, LLC,
1992.
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| Online Access: | Connect to the full text of this electronic book |
Table of Contents:
- pt. I. Overview
- pt. II. Basic technologies
- pt. III. Methodologies and applications
- pt. IV. Reliability, quality control, and tests
- pt. V. Appendix.