Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly /

Bibliographic Details
Main Author:	Hwang, Jennie S.
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	New York : Springer Science+Business Media, LLC, 1992.
Subjects:	Printed circuits > Design and construction. Solder pastes. Surface mount technology. Electronic books.
Online Access:	Connect to the full text of this electronic book

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