Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly /
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| Format: | eBook |
| Language: | English |
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New York :
Springer Science+Business Media, LLC,
1992.
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| Online Access: | Connect to the full text of this electronic book |
| Item Description: | Originally published by Van Nostrand Reinhold in 1992. Electronic resource. |
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| Physical Description: | 1 online resource (xxii, 456 pages) : illustrations |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 9781461535287 (electronic bk.) 146153528X (electronic bk.) |