APA (7th ed.) Citation

Hwang, J. S. (1992). Solder paste in electronics packaging: Technology and applications in surface mount, hybrid circuits, and component assembly. Springer Science+Business Media, LLC.

Chicago Style (17th ed.) Citation

Hwang, Jennie S. Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. New York: Springer Science+Business Media, LLC, 1992.

MLA (9th ed.) Citation

Hwang, Jennie S. Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. Springer Science+Business Media, LLC, 1992.