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Benefiting from thermal and mechanical simulation in micro-electronics /

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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss pr...

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Bibliographic Details
Corporate Authors: EuroSimE Eindhoven, Netherlands, SpringerLink (Online service)
Other Authors: Zhang, G. Q. (Editor), Ernst, L. J. (Editor), Saint Leger, O. de (Editor)
Format: Conference Proceeding eBook
Language:English
Published: Dordrecht : Springer Science+Business Media, [2000]
Subjects:
Microelectronics > Congresses.
Microelectronics > Simulation methods > Congresses.
Micromechanics > Congresses.
Microelectronics.
Microelectronics > Simulation methods.
Micromechanics.
Electronic books.
Conference proceedings.
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Call Number: TK7874 .E97 2000
 
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TK7874 .E97 2000 Available