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Advances in electronic circuit packaging. Vol 3, Proceedings of the International Electronic Circuit Packaging Symposium /

Bibliographic Details
Corporate Authors: International Electronic Circuit Packaging Symposium Boulder, Colo., SpringerLink (Online service), University of Colorado (Boulder campus)
Other Authors: Rosine, Lawrence L. (Editor)
Format: Conference Proceeding eBook
Language:English
Subjects:
Electronic packaging > Congresses.
Encapsulation (électronique) > Congrès.
Mise sous boîtier (électronique) > Congrès.
Electronic packaging.
Electronic books.
Conference proceedings.
Online Access:Connect to the full text of this electronic book
Description
Item Description:"Sponsored by the University of Colorado, EDN (Electrical design news), and Design news."
Physical Description:1 online resource (vi, 457 pages) : illustrations
Bibliography:Includes bibliographical references.
ISBN:9781489973092 (electronic bk.)
1489973095 (electronic bk.)