Advances in electronic circuit packaging. Vol 3, Proceedings of the International Electronic Circuit Packaging Symposium /

Bibliographic Details
Corporate Authors:	International Electronic Circuit Packaging Symposium Boulder, Colo., SpringerLink (Online service), University of Colorado (Boulder campus)
Other Authors:	Rosine, Lawrence L. (Editor)
Format:	Conference Proceeding eBook
Language:	English
Subjects:	Electronic packaging > Congresses. Encapsulation (électronique) > Congrès. Mise sous boîtier (électronique) > Congrès. Electronic packaging. Electronic books. Conference proceedings.
Online Access:	Connect to the full text of this electronic book

Available Online