International Electronic Circuit Packaging Symposium Boulder, Colo, SpringerLink (Online service), University of Colorado (Boulder campus), & Rosine, L. L. (1963). Advances in electronic circuit packaging.
Chicago Style (17th ed.) CitationInternational Electronic Circuit Packaging Symposium Boulder, Colo, SpringerLink (Online service), University of Colorado (Boulder campus), and Lawrence L. Rosine. Advances in Electronic Circuit Packaging. 1963.
MLA (9th ed.) CitationInternational Electronic Circuit Packaging Symposium Boulder, Colo, et al. Advances in Electronic Circuit Packaging. 1963.
Warning: These citations may not always be 100% accurate.