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Advances in electronic circuit packaging. Vol 2, Proceedings of the International Electronic Circuit Packaging Symposium /

Bibliographic Details
Corporate Authors:	International Electronic Circuit Packaging Symposium Boulder, Colo., SpringerLink (Online service), University of Colorado (Boulder campus)
Other Authors:	Walker, Gerald A. (Editor)
Format:	Conference Proceeding eBook
Language:	English
Published:	New York : Springer Science + Business Media, 1962.
Subjects:	Electronic packaging > Congresses. Electronic packaging. Electronic books. Conference proceedings.
Online Access:	Connect to the full text of this electronic book

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