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Advances in electronic circuit packaging. Vol 2, Proceedings of the International Electronic Circuit Packaging Symposium /

Bibliographic Details
Corporate Authors: International Electronic Circuit Packaging Symposium Boulder, Colo., SpringerLink (Online service), University of Colorado (Boulder campus)
Other Authors: Walker, Gerald A. (Editor)
Format: Conference Proceeding eBook
Language:English
Published: New York : Springer Science + Business Media, 1962.
Subjects:
Electronic packaging > Congresses.
Electronic packaging.
Electronic books.
Conference proceedings.
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Call Number: TK7870
 
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