Thermal stress and strain in microelectronics packaging /

Bibliographic Details
Corporate Author:	SpringerLink (Online service)
Other Authors:	Lau, John H.
Format:	eBook
Language:	English
Published:	New York : Van Nostrand Reinhold, [1993]
Subjects:	Electronic packaging. Microelectronic packaging. Thermal stresses. Mikroelektronik. Thermomechanische Eigenschaft. Electronic equipment > Packaging Electronic books.
Online Access:	Connect to the full text of this electronic book

Available Online