IC interconnect analysis /
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of the...
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| Format: | eBook |
| Language: | English |
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Boston, Mass. ; London :
Kluwer Academic Publishers,
[2002]
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| Online Access: | Connect to the full text of this electronic book |
Internet
Connect to the full text of this electronic bookAvailable Online
| Call Number: |
TK7874.53 .C45 2002eb |
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| Call Number | Status | Get It |
| TK7874.53 .C45 2002eb | Available | |