Microelectronics packaging handbook /
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelec...
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| Other Authors: | , |
| Format: | eBook |
| Language: | English |
| Published: |
New York :
Chapman & Hall,
[1997]
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| Edition: | 2nd ed. |
| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
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