Microelectronics packaging handbook /

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelec...

Full description

Bibliographic Details

Corporate Author:	SpringerLink (Online service)
Other Authors:	Tummala, Rao R., 1942-, Rymaszewski, Eugene J.
Format:	eBook
Language:	English
Published:	New York : Chapman & Hall, [1997]
Edition:	2nd ed.
Subjects:	Microelectronic packaging > Handbooks, manuals, etc. Tecnicas gerais de fabricacao de circuitos integrados. Microelectronic packaging. Electronic books. Handbooks, manuals, etc.
Online Access:	Connect to the full text of this electronic book