Copper electrodeposition for nanofabrication of electronics devices /

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: ULSI wiring material based upon cop...

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Bibliographic Details
Corporate Author:	Ebook Library
Other Authors:	Kondo, K. (Kazuo), Akolkar, Rohan N., Barkey, Dale P., Yokoi, Masayuki
Format:	eBook
Language:	English
Published:	New York : Springer Science+Business Media, [2014]
Series:	Nanostructure science and technology.
Subjects:	Copper plating. Electronic apparatus and appliances. Electronics. Electronic books.
Online Access:	Connect to the full text of this electronic book

Description
Summary:	This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: ULSI wiring material based upon copper nanowiring Printed circuit boards Stacked semiconductors Through Silicon Via Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Item Description:	Electronic resource.
Physical Description:	1 online resource (viii, 282 pages)
Bibliography:	Includes bibliographical references.
ISBN:	9781461491767 (eBook) 1461491762
ISSN:	2197-7976