Copper electrodeposition for nanofabrication of electronics devices /

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: ULSI wiring material based upon cop...

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Bibliographic Details

Corporate Author:	Ebook Library
Other Authors:	Kondo, K. (Kazuo), Akolkar, Rohan N., Barkey, Dale P., Yokoi, Masayuki
Format:	eBook
Language:	English
Published:	New York : Springer Science+Business Media, [2014]
Series:	Nanostructure science and technology.
Subjects:	Copper plating. Electronic apparatus and appliances. Electronics. Electronic books.
Online Access:	Connect to the full text of this electronic book