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Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers /

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Bibliographic Details
Main Author: Franke, Jörg, Dipl.-Ing
Format: Book
Language:English
Published: Munich ; Cincinnati : Hanser Publishers, [2014]
Subjects:
Interconnects (Integrated circuit technology) > Design and construction.
Injection molding of plastics.
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