Three-dimensional molded interconnect devices (3D-MID) : materials, manufacturing, assembly, and applications for injection molded circuit carriers /

Bibliographic Details
Main Author:	Franke, Jörg, Dipl.-Ing
Format:	Book
Language:	English
Published:	Munich ; Cincinnati : Hanser Publishers, [2014]
Subjects:	Interconnects (Integrated circuit technology) > Design and construction. Injection molding of plastics.

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