Copper wire bonding /

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost...

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Bibliographic Details

Main Author:	Chauhan, Preeti S. (Author)
Corporate Author:	Ebook Library
Format:	eBook
Language:	English
Published:	New York : Springer, [2013?]
Subjects:	Wire bonding (Electronic packaging) Copper wire. Engineering. Optical and Electronic Materials. TECHNOLOGY & ENGINEERING / Mechanical. Electronic books.
Online Access:	Connect to the full text of this electronic book