Intern experience at Packages Limited : an internship report /

Bibliographic Details
Main Author:	Shafkey, Refaat
Corporate Author:	Texas A & M University. College of Engineering
Format:	Manuscript
Language:	English
Published:	[Place of publication not identified] : [publisher not identified] ; 1985.
Subjects:	Packages Limited. Mechanical engineering > Pakistan > Lahore. Packaging > Pakistan > Lahore. Major Mechanical Engineering.
Online Access:	Link to OAK Trust copy

Description
Item Description:	Typescript (photocopy). "Submitted to the College of Engineering, Texas A & M University in partial fulfillment of the requirement for the degree of Doctor of Engineering." "August 1985." "Major subject: Mechanical Engineering."
Physical Description:	1 volume (various pagings) : illustrations ; 28 cm.