Intern experience at Packages Limited : an internship report /

Bibliographic Details
Main Author:	Shafkey, Refaat
Corporate Author:	Texas A & M University. College of Engineering
Format:	Manuscript
Language:	English
Published:	[Place of publication not identified] : [publisher not identified] ; 1985.
Subjects:	Packages Limited. Mechanical engineering > Pakistan > Lahore. Packaging > Pakistan > Lahore. Major Mechanical Engineering.
Online Access:	Link to OAK Trust copy

Link to OAK Trust copy

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