Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC /

Bibliographic Details

Main Author:	Li, Er-Ping
Format:	eBook
Language:	English
Published:	[United States] : Hoboken : IEEE Press ; Wiley, [2012]
Series:	Wiley Online Library.
Subjects:	Three-dimensional integrated circuits. Electronic books.
Online Access:	Connect to the full text of this electronic book