Advances in CMP/polishing technologies for the manufacture of electronic devices /

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.

Bibliographic Details

Corporate Author:	ScienceDirect (Online service)
Other Authors:	Doi, Toshiro, Marinescu, Ioan D., Kurokawa, Syuhei
Format:	eBook
Language:	English
Published:	Oxford : William Andrew, 2012.
Edition:	1st ed.
Subjects:	Electrolytic polishing. Grinding and polishing. Electronic books.
Online Access:	Connect to the full text of this electronic book